27.04.17

ITherm 2017

May 30-June 2 in Orlando, Florida

At ITherm 2017, Staubli engineers will share their electronic cooling and fluid management expertise at the upcoming Institute of Electrical and Electronics Engineers ITHERM event in Orlando, May 30-June 2, 2017).   

The higher density of today's computing and power management equipment is forcing designers and engineers to consider something more efficient than air for managing temperatures. Liquid cooling is a viable option when the right components are selected to manage those fluids.

Staubli will feature a complete line of all-metallic, non-spill, dry-break, quick-disconnect couplings for electronics cooling applications. We offer couplings that can be used with systems that access the point of connection and blind mate" couplings that enable the flow of cooling fluids simply by sliding system components together. The reliability of metal couplings is essential in these critical applications, and we will have blind mate and manual couplings for attendees to examine.